Lear Displays Automotive Industry's First Solid-State Smart Junction Box on Escape Hybrid at Convergence
DETROIT, Oct. 16 /PRNewswire-FirstCall/ -- Lear Corporation (NYSE:
LEA) today announced an "industry first" with the introduction of its
Solid-State Smart Junction Box Technology (S3JB) which provides a
dramatic improvement in volume, a significant reduction in weight and
lower systems cost as well as improved electrical-system diagnostics and
double failure-mode protection.
(Photo: http://www.newscom.com/cgi-bin/prnh/20061016/DEM002 )
The S3JB, developed in a partnership among Lear, STMicroelectronics
(ST) and Smart Automotive System Engineering (SASE), will be
demonstrated on a 2006 Ford Escape at the Convergence 2006 Electronics
Show at Detroit's Cobo Hall from October 16 - 18 at the
STMicroelectronics Booth #1139.
The primary architecture utilizes Lear's capabilities for Smart
Junction boxes, connection systems, thermal management, software
algorithms and electrical distribution systems and integrates ST's
state-of-the-art Advanced Power Management solid-state drivers as the
core to create the S3JB. SASE, a specialist in the application of
automotive and commercial electronics, served as technology consultant
in the development of the S3JB.
Smart Junction Box technology is the main hub in a vehicle's
electrical system, controlling and providing power to various electrical
features such as power windows, power door locks, lighting (interior
and exterior), instrumentation and the audio system. Current Smart
Junction Box technology combines fuses, relays, a microcontroller and
multiple (circuit board and fret) layers of interconnection into a
single integrated assembly.
When Lear's advanced connection systems are combined with ST's
solid-state drivers, the smart junction box is reduced from
multiple-printed circuit boards to a single small-printed circuit board.
The smaller board reduces the number of parts, manufacturing
complexity and size of the junction box.
"The S3JB represents a significant improvement over existing Smart
Junction technology because it replaces the relatively large fuses and
relays with ST's solid-state drivers," said Mohamad Zeidan, Manager of
Electrical Distribution Systems Engineering for Lear. "This translates
into a 50 - 80% reduction in volume, which allows greater packaging
flexibility and optimization of the location because of the smaller size
and elimination of the requirement for owner access, as well as a 40 -
70% reduction in weight and a 5 - 20% reduction in systems cost."
"ST's unique solid-state drivers also contain proprietary technology,
which results in lower processor computational load as well as more
efficient utilization of the electrical distribution system," said
Joseph Notaro, Director Market Development - NA Automotive Business Unit
for STMicroelectronics. "Using this technology, we can achieve up to a
1 kg saving in the weight of copper in a vehicle."
More importantly, the S3JB technology is an enabler for the
integration of additional feature content into the Smart Junction Box.
This integration combined with the benefits from the S3JB results in a
sizable cost reduction for the electrical system as well as a modest
improvement in fuel efficiency.
* The S3JB results in a 50% package size reduction
Easier to package
More space available for consumer
* The S3JB does not require customer access
More packaging location opportunities
Optimization of package location for harness interconnection
Optimization of package location for EDS Efficiency
* Reduction of up to 1 kg of copper wire
* Reduction in the weight of the JB by up to 0.4 kg
Reliability / Durability
* No mechanical contacts to wear out
* Improved Diagnostics
* Limp Home capability
* Reduction of wiring
* Integration of the individual modules into a single integrated
S3JB results in a cost reduction ranging from 5% for low content
implementations to 20% or more for higher content solutions.
Lear Corporation is one of the world's largest suppliers of
automotive interior systems and components. Lear provides complete
automotive seating systems, electronic products and electrical
distribution systems as well as interior trim components. With annual
net sales of $17.1 billion in 2005, Lear ranks #127 among the Fortune
500. The Company's world-class products are designed, engineered and
manufactured by a diverse team of more than 110,000 employees in 34
countries. Lear's headquarters are in Southfield, Michigan, and Lear is
traded on the New York Stock Exchange under the symbol [LEA]. Further
information about Lear is available on the Internet at http://www.lear.com/ .
STMicroelectronics is a global leader in developing and delivering
semiconductor solutions across the spectrum of microelectronics
applications. An unrivalled combination of silicon and system expertise,
manufacturing strength, Intellectual Property (IP) portfolio and
strategic partners positions the Company at the forefront of
System-on-Chip (SoC) technology and its products play a key role in
enabling today's convergence markets. The Company's shares are traded
on the New York Stock Exchange, on Euronext Paris and on the Milan Stock
Exchange. In 2005, the Company's net revenues were $8.88 billion and
net earnings were $266 million. Further information on ST can be found
at http://www.st.com/ .
Photo: NewsCom: http://www.newscom.com/cgi-bin/prnh/20061016/DEM002
Photo Desk, email@example.com
SOURCE: Lear Corporation
CONTACT: Investor Relations: Mel Stephens, +1-248-447-1624, Media:
Puchalsky, +1-248-447-1651, both of Lear Corporation
Web site: http://www.lear.com/
Company News On-Call: http://www.prnewswire.com/comp/518304.html
Posted on 10/16/2006